Indium Corporation’s Solder Thermal Interface Materials radically improve:
Heat dissipation efficiency in electronic devices
Thermal conductance for high power devices – with densities in excess of 1000 watts
End-of-life performance at the thermal interface – to avoid failures common with fluidic solutions such as greases
Portable device battery performance – by reducing thermal resistance and cooling fan size
Portable device use profile – by reducing heatsink size and mass
Compliance with RoHS while accommodating step soldering requirements
Indium Corporation has solutions for:
Telecom
Medical
Computing
Cryogenics
Semiconductors
Automotives
LEDs
Power Devices
Photonics
Indium Corporation’s Solder Thermal Interface Materials radically improve:
- Heat dissipation efficiency in electronic devices
- Thermal conductance for high power devices – with densities in excess of 1000 watts
- End-of-life performance at the thermal interface – to avoid failures common with fluidic solutions such as greases
- Portable device battery performance – by reducing thermal resistance and cooling fan size
- Portable device use profile – by reducing heatsink size and mass
- Compliance with RoHS while accommodating step soldering requirements
Indium Corporation has solutions for:
- Telecom
- Medical
- Computing
- Cryogenics
- Semiconductors
- Automotives
- LEDs
- Power Devices
- Photonics
