Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it is especially important to choose the right alloy. Indium, in particular, should be considered as a sTIM because of its high thermal conductivity, compressibility (SMA-TIM), and ease of application.
| Indium Corporation | |
|---|---|
| Product Category | Thermal Compounds and Thermal Interface Materials |
| Product Name | Indium Thermal Interface Materials (TIM) |
| Industry | Semiconductors, IC's |
