ITW Chemtronics Thermal Grease CW7270

Description
C/works Silicone Free HeatSink Grease 8g
  • Thermal Grease - 6654846 - RS Components, Ltd.
    RS Components, Ltd.
  • Thermal Grease, Syringe, 8G; Dispensing Method Chemtronics - 10P1056 - Newark, An Avnet Company
    Newark, An Avnet Company
Request a Quote Datasheet
Description
C/works Silicone Free HeatSink Grease 8g
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Grease - 6654846 - RS Components, Ltd.
RS Components, Ltd.
Corby, Northants, United Kingdom
Thermal Grease
6654846
Thermal Grease 6654846
C/works Silicone Free HeatSink Grease 8g

C/works Silicone Free HeatSink Grease 8g

Supplier's Site
Thermal Grease, Syringe, 8G; Dispensing Method Chemtronics - 10P1056 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Grease, Syringe, 8G; Dispensing Method Chemtronics
10P1056
Thermal Grease, Syringe, 8G; Dispensing Method Chemtronics 10P1056
THERMAL GREASE, SYRINGE, 8G; Dispensing Method:Syringe; Volume:-; Weight:8g; Product Range:CircuitWorks Series RoHS Compliant: Yes

THERMAL GREASE, SYRINGE, 8G; Dispensing Method:Syringe; Volume:-; Weight:8g; Product Range:CircuitWorks Series RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  RS Components, Ltd. Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials Thermal Compounds and Thermal Interface Materials
Product Number 6654846 10P1056
Product Name Thermal Grease Thermal Grease, Syringe, 8G; Dispensing Method Chemtronics
Form / Shape Grease, Paste
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - SnapTrace® - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
SnapTrace®
Specs
Form / Shape 4ft Lengths; Gap Filler, Foam in Place Gasket
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details
Thermal Pads - 606919 - RS Components, Ltd.
RS Components, Ltd.
Thermal Pads
606919
Specs
Thermal Conductivity 2.8 W/m-K (1.62 BTU-ft/hr-ft²-F)
View Details
One Component Thermally Conductive Epoxy Film - FL901AO - Master Bond, Inc.
Master Bond, Inc.
One Component Thermally Conductive Epoxy Film
FL901AO
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Chemical System Epoxy
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details