The Kester NXG1 no clean lead-free solder paste is another quality product from Kester. Total composition for this lead-free solder paste is sn96.5/ag03/cu0.5.
| R. S. Hughes Company, Inc. | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | 70-3213-0810 |
| Product Name | Kester NXG1 No Clean Lead-Free Solder Paste Jar 7032130810 - 500 g |
| Joining Process / Product Form | Braze or solder in the form of a paste. |
