ITW Chemtronics 60-5-10

  • 7622698 - RS Components, Ltd.
    RS Components, Ltd.
Description
De-soldering braid packaged in static dissipative bobbins. Significantly reduces rework/repair time. Minimises the risk of damage to the board. Patented non-corrosive, halide free, organic no-clean flux. BGA desolder braid is designed for removing solder from BGA pads and chips Width = 3.7mm Length = 3m No Clean = Yes
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- 7622698 - RS Components, Ltd.
RS Components, Ltd.
Corby, Northants, United Kingdom
7622698
7622698
De-soldering braid packaged in static dissipative bobbins. Significantly reduces rework/repair time. Minimises the risk of damage to the board. Patented non-corrosive, halide free, organic no-clean flux. BGA desolder braid is designed for removing solder from BGA pads and chips Width = 3.7mm Length = 3m No Clean = Yes

De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time. Minimises the risk of damage to the board. Patented non-corrosive, halide free, organic no-clean flux. BGA desolder braid is designed for removing solder from BGA pads and chips
Width = 3.7mm
Length = 3m
No Clean = Yes

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Technical Specifications

  RS Components, Ltd.
Product Category Filler Alloys and Consumables
Product Number 7622698
Joining Process / Product Form Desoldering Wicks & Braids
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