Illinois Tool Works Inc. Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 24-9574-6409 - 1 lb - 0.05 in Wire Diameter - Sn/Cu/Ni/Bi Compound 24-9574-6409

Description
The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is k100ld.
  • Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 24-9574-6409 - 1 lb - 0.05 in Wire Diameter - Sn/Cu/Ni/Bi Compound - 24-9574-6409 - R. S. Hughes Company, Inc.
    R. S. Hughes Company, Inc.
Description
The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is k100ld.

Suppliers

Company
Product
Description
Supplier Links
Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 24-9574-6409 - 1 lb - 0.05 in Wire Diameter - Sn/Cu/Ni/Bi Compound - 24-9574-6409 - R. S. Hughes Company, Inc.
R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 24-9574-6409 - 1 lb - 0.05 in Wire Diameter - Sn/Cu/Ni/Bi Compound
24-9574-6409
Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 24-9574-6409 - 1 lb - 0.05 in Wire Diameter - Sn/Cu/Ni/Bi Compound 24-9574-6409
The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is k100ld.

The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is k100ld.

Buy Now

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Filler Alloys and Consumables
Product Number 24-9574-6409
Product Name Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 24-9574-6409 - 1 lb - 0.05 in Wire Diameter - Sn/Cu/Ni/Bi Compound
Joining Process / Product Form Solid wire or rod
Unlock Full Specs
to access all available technical data

Similar Products

Solder - 8007652 - RS Components, Ltd.
RS Components, Ltd.
Solder
8007652
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0500 inch (1.27 mm)
Solder Alloy Tin-Lead Alloy Solder (SN-Pb)
View Details
Printed Circuit Board (PCB) Solder Stencils - ALPHA ® Precision Milled Stencils - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Printed Circuit Board (PCB) Solder Stencils
ALPHA ® Precision Milled Stencils
Specs
Joining Process / Product Form Braze or solder in the form of a paste.
View Details
Welding Consumable - Stainless Alloys - Blue Max® MIG 316LSi - Lincoln Electric Co. (The)
Lincoln Electric Co. (The)
Welding Consumable - Stainless Alloys
Blue Max® MIG 316LSi
Specs
Applications / Materials Joined For Joining and Cladding 316L Joints and Overlays, "18-8" Steels, ASTM A240 Types 316 and 316L, ASTM A743, A744 Types CF-8M & CF-3M
Joining Process / Product Form MIG Spool (GMAW)
Diameter / Thickness 0.0300 to 0.1250 inch (0.7620 to 3.17 mm)
View Details
70/30 Tin Zinc Solder - 7702B - Belmont Metals, Inc.
Belmont Metals, Inc.
70/30 Tin Zinc Solder
7702B
Specs
Applications / Materials Joined Electronics, Plating, Plumbing
Joining Process / Product Form 2-8 Ingot
Nominal Composition 70/30 Tin Zinc
View Details