Illinois Tool Works Inc. Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 24-9574-6409 - 1 lb - 0.05 in Wire Diameter - Sn/Cu/Ni/Bi Compound 24-9574-6409

Description
The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is k100ld.
Description
The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is k100ld.

Suppliers

Company
Product
Description
Supplier Links
Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 24-9574-6409 - 1 lb - 0.05 in Wire Diameter - Sn/Cu/Ni/Bi Compound - 24-9574-6409 - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 24-9574-6409 - 1 lb - 0.05 in Wire Diameter - Sn/Cu/Ni/Bi Compound
24-9574-6409
Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 24-9574-6409 - 1 lb - 0.05 in Wire Diameter - Sn/Cu/Ni/Bi Compound 24-9574-6409
The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is k100ld.

The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is k100ld.

Buy Now

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Filler Alloys and Consumables
Product Number 24-9574-6409
Product Name Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 24-9574-6409 - 1 lb - 0.05 in Wire Diameter - Sn/Cu/Ni/Bi Compound
Joining Process / Product Form Solid wire or rod
Unlock Full Specs
to access all available technical data

Similar Products

AccuFlux ® Preforms: ALPHA ® AccuFlux ® BTC-578 -  - MacDermid Alpha Electronics Solutions
Specs
Fluxes & Cleaners Soldering Flux / Rosin
View Details
Solder - 2013545 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0295 inch (0.7500 mm)
Solder Alloy Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
View Details
Hard Surfacing Alloy - Universal Cobalt Alloy No.1 - Universal Wire Works Inc.
Specs
Joining Process / Product Form Solid wire or rod
Diameter / Thickness 0.0450 to 0.1560 inch (1.14 to 3.96 mm)
Nominal Composition 2.5C-29.5Cr-2Fe-1Mo-2Ni-1Si-12.5W-BalanceCo
View Details
Welding Consumables -  - Linde North America, Inc.
Linde North America, Inc.
View Details