Illinois Tool Works Inc. Solder 24-9574-1401

Description
Lead Free Rosin Activated (RA) Wire Solder Sn99.3Cu0.7 (99.3/0.7) 24 AWG, 25 SWG Spool, 1 lb (454 g)
Request a Quote Datasheet
Description
Lead Free Rosin Activated (RA) Wire Solder Sn99.3Cu0.7 (99.3/0.7) 24 AWG, 25 SWG Spool, 1 lb (454 g)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Solder - 24-9574-1401-ND - DigiKey
Thief River Falls, MN, United States
Lead Free Rosin Activated (RA) Wire Solder Sn99.3Cu0.7 (99.3/0.7) 24 AWG, 25 SWG Spool, 1 lb (454 g)

Lead Free Rosin Activated (RA) Wire Solder Sn99.3Cu0.7 (99.3/0.7) 24 AWG, 25 SWG Spool, 1 lb (454 g)

Buy Now Datasheet
Kester 48 Activated Rosin Flux Core Lead-Free Solder Wire 24-9574-1401 - 1 lb - 0.02 in Wire Diameter - Sn/Cu/Ni/Bi Compound - 24-9574-1401 - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Kester 48 Activated Rosin Flux Core Lead-Free Solder Wire 24-9574-1401 - 1 lb - 0.02 in Wire Diameter - Sn/Cu/Ni/Bi Compound
24-9574-1401
Kester 48 Activated Rosin Flux Core Lead-Free Solder Wire 24-9574-1401 - 1 lb - 0.02 in Wire Diameter - Sn/Cu/Ni/Bi Compound 24-9574-1401
The Kester 48 activated rosin flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +792 F. It's manufactured as an activated rosin flux core. Total composition for this activated rosin flux core lead-free solder wire is k100ld.

The Kester 48 activated rosin flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +792 F. It's manufactured as an activated rosin flux core. Total composition for this activated rosin flux core lead-free solder wire is k100ld.

Buy Now

Technical Specifications

  DigiKey R. S. Hughes Company, Inc.
Product Category Filler Alloys and Consumables Filler Alloys and Consumables
Product Number 24-9574-1401-ND 24-9574-1401
Product Name Solder Kester 48 Activated Rosin Flux Core Lead-Free Solder Wire 24-9574-1401 - 1 lb - 0.02 in Wire Diameter - Sn/Cu/Ni/Bi Compound
Joining Process / Product Form Solid wire or rod; Spool, 1 lb (454 g) Solid wire or rod
Unlock Full Specs
to access all available technical data

Similar Products

Solder Alloys for Electronics - ALPHA ® HRL3 Solid Solder - MacDermid Alpha Electronics Solutions
Specs
Joining Process / Product Form Braze or solder in the form of a paste.
Solder Alloy Lead Free
View Details
Solder - 2349589 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0276 inch (0.7000 mm)
Melting Range 423 F (217 C)
View Details
Rope Hardfacing Flexible Cord - Grade M Tuf-Cote® - Saint-Gobain Coating Solutions
Specs
Joining Process / Product Form A multi-layered preform for brazing carbide or joining materials with compatibility issues.
Braze Alloy Nickel Alloy Braze; Tungsten Carbide
View Details
Aluminum Brazing Compound - FL-7® - Esprix Technologies
Specs
Nominal Composition Tetrafluoro Potassium Aluminate (KAlF4); Pentafluoro Potassium Monohydrate (K2AlF5 · H20)
Braze Alloy Aluminum Alloy Braze
View Details