Lead Free No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 20 AWG, 22 SWG Spool, 1 lb (454 g)
The Kester 275 no clean flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +700 F. It's manufactured as a no clean flux core. Total composition for this no clean flux core lead-free solder wire is sn96.5/ag03/cu0.5. Additional, and potentially important, information was collected about this product: Flux Size: 58
Solder Wire; no-clean flux; lead-free; Sn96.5Ag3.0Cu0.5; .031 dia; core 58; 1 lb
| DigiKey | R. S. Hughes Company, Inc. | Allied Electronics, Inc. | |
|---|---|---|---|
| Product Category | Filler Alloys and Consumables | Filler Alloys and Consumables | Filler Alloys and Consumables |
| Product Number | KE1137-ND | 24-7068-7601 | 70177872 |
| Product Name | Solder | Kester 275 No Clean Flux Core Lead-Free Solder Wire 24-7068-7601 - 1 lb - 0.031 in Wire Diameter - Sn/Ag/Cu Compound | Solder Wire; no-clean flux; lead-free; Sn96.5Ag3.0Cu0.5; .031 dia; core 58; 1 lb |
| Joining Process / Product Form | Solid wire or rod; Spool, 1 lb (454 g) | Solid wire or rod | Solid wire or rod |
