Lead Free Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 27 AWG, 28 SWG Spool, 1 lb (454 g)
The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is sn96.5/ag03/cu0.5.
| DigiKey | R. S. Hughes Company, Inc. | |
|---|---|---|
| Product Category | Filler Alloys and Consumables | Filler Alloys and Consumables |
| Product Number | KE1891-ND | 24-7068-6422 |
| Product Name | Solder | Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 24-7068-6422 - 1 lb - 0.015 in Wire Diameter - Sn/Ag/Cu Compound |
| Joining Process / Product Form | Solid wire or rod; Spool, 1 lb (454 g) | Solid wire or rod |
