Lead Free Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 14 AWG, 16 SWG Spool, 1 lb (454 g)
The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is sn96.5/ag03/cu0.5.
Solder Wire; water-sol flux; lead-free;Sn96.5Ag3.
| DigiKey | R. S. Hughes Company, Inc. | Allied Electronics, Inc. | |
|---|---|---|---|
| Product Category | Filler Alloys and Consumables | Filler Alloys and Consumables | Filler Alloys and Consumables |
| Product Number | KE1130-ND | 24-7068-6411 | 70177885 |
| Product Name | Solder | Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 24-7068-6411 - 1 lb - 0.062 in Wire Diameter - Sn/Ag/Cu Compound | Solder Wire; water-sol flux; lead-free;Sn96.5Ag3.0Cu0.5; .062 dia; core 66;1 lb |
| Joining Process / Product Form | Solid wire or rod; Spool, 1 lb (454 g) | Solid wire or rod | Solid wire or rod |
