Illinois Tool Works Inc. Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 24-7061-6441 - 1 lb - 0.01 in Wire Diameter - Sn/Ag/Cu Compound 24-7061-6441

Description
The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is sn95.5/ag04/cu0.5.
Description
The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is sn95.5/ag04/cu0.5.

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Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 24-7061-6441 - 1 lb - 0.01 in Wire Diameter - Sn/Ag/Cu Compound - 24-7061-6441 - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 24-7061-6441 - 1 lb - 0.01 in Wire Diameter - Sn/Ag/Cu Compound
24-7061-6441
Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 24-7061-6441 - 1 lb - 0.01 in Wire Diameter - Sn/Ag/Cu Compound 24-7061-6441
The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is sn95.5/ag04/cu0.5.

The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is sn95.5/ag04/cu0.5.

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Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Filler Alloys and Consumables
Product Number 24-7061-6441
Product Name Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 24-7061-6441 - 1 lb - 0.01 in Wire Diameter - Sn/Ag/Cu Compound
Joining Process / Product Form Solid wire or rod
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