Illinois Tool Works Inc. Solder 14-6337-0031

Description
Leaded Wire Solder Sn63Pb37 (63/37) 20 AWG, 22 SWG Spool, 1 lb (454 g)
  • Solder - KE1606-ND - DigiKey
    DigiKey
  • Kester Lead Solder Wire 14-6337-0031 - 1 lb - 0.031 in Wire Diameter - Sn/Pb Compound - 14-6337-0031 - R. S. Hughes Company, Inc.
    R. S. Hughes Company, Inc.
Request a Quote Datasheet
Description
Leaded Wire Solder Sn63Pb37 (63/37) 20 AWG, 22 SWG Spool, 1 lb (454 g)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Solder - KE1606-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
Solder
KE1606-ND
Solder KE1606-ND
Leaded Wire Solder Sn63Pb37 (63/37) 20 AWG, 22 SWG Spool, 1 lb (454 g)

Leaded Wire Solder Sn63Pb37 (63/37) 20 AWG, 22 SWG Spool, 1 lb (454 g)

Buy Now Datasheet
Kester Lead Solder Wire 14-6337-0031 - 1 lb - 0.031 in Wire Diameter - Sn/Pb Compound - 14-6337-0031 - R. S. Hughes Company, Inc.
R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Kester Lead Solder Wire 14-6337-0031 - 1 lb - 0.031 in Wire Diameter - Sn/Pb Compound
14-6337-0031
Kester Lead Solder Wire 14-6337-0031 - 1 lb - 0.031 in Wire Diameter - Sn/Pb Compound 14-6337-0031
The Kester lead solder wire is another quality product from Kester. Melting point is reached at a temperature of +361 F. It's manufactured as a solder without flux core. Total composition for this lead solder wire is sn63/pb37.

The Kester lead solder wire is another quality product from Kester. Melting point is reached at a temperature of +361 F. It's manufactured as a solder without flux core. Total composition for this lead solder wire is sn63/pb37.

Buy Now

Technical Specifications

  DigiKey R. S. Hughes Company, Inc.
Product Category Filler Alloys and Consumables Filler Alloys and Consumables
Product Number KE1606-ND 14-6337-0031
Product Name Solder Kester Lead Solder Wire 14-6337-0031 - 1 lb - 0.031 in Wire Diameter - Sn/Pb Compound
Joining Process / Product Form Solid wire or rod; Spool, 1 lb (454 g) Solid wire or rod
Unlock Full Specs
to access all available technical data

Similar Products

Solder Preforms - AccuFlux ® Preforms: ALPHA ® AccuFlux ® BTC-578 - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Solder Preforms
AccuFlux ® Preforms: ALPHA ® AccuFlux ® BTC-578
Specs
Joining Process / Product Form Braze or solder in the form of a paste.
Fluxes & Cleaners Soldering Flux / Rosin
View Details
Solder - 2349589 - RS Components, Ltd.
RS Components, Ltd.
Solder
2349589
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0276 inch (0.7000 mm)
Melting Range 423 F (217 C)
View Details
Solder Pastes - LOCTITE CR 32 - Henkel Corporation - Industrial
Henkel Corporation - Industrial
Solder Pastes
LOCTITE CR 32
Specs
Joining Process / Product Form Braze or solder in the form of a paste.
View Details
Morgan Advanced Materials
Active Brazing Filler Metal Copper-ABA®
Specs
Joining Process / Product Form Braze or solder in the form of a paste. (optional feature); Strip, sheet or foil (optional feature); Solid wire or rod (optional feature)
Melting Range 1756 to 1875 F (958 to 1024 C)
Braze Alloy Copper Alloy Braze
View Details