ITW Devcon Devcon Floor Patch Base & Accelerator (B/A) Asphalt & Concrete Sealant - Gray Liquid 10 lb - 13110 13110

Description
Devcon Floor Patch gray asphalt & concrete sealant with a 7 day cure time. Provides a 15 min working time. Works in a mix ratio of 2:1. Maximum operating temperature is +250 F. Perfect for patching applications.
Datasheet
Description
Devcon Floor Patch gray asphalt & concrete sealant with a 7 day cure time. Provides a 15 min working time. Works in a mix ratio of 2:1. Maximum operating temperature is +250 F. Perfect for patching applications.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Devcon Floor Patch Base & Accelerator (B/A) Asphalt & Concrete Sealant - Gray Liquid 10 lb - 13110 - 078143-13110 - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Devcon Floor Patch Base & Accelerator (B/A) Asphalt & Concrete Sealant - Gray Liquid 10 lb - 13110
078143-13110
Devcon Floor Patch Base & Accelerator (B/A) Asphalt & Concrete Sealant - Gray Liquid 10 lb - 13110 078143-13110
Devcon Floor Patch gray asphalt & concrete sealant with a 7 day cure time. Provides a 15 min working time. Works in a mix ratio of 2:1. Maximum operating temperature is +250 F. Perfect for patching applications.

Devcon Floor Patch gray asphalt & concrete sealant with a 7 day cure time. Provides a 15 min working time. Works in a mix ratio of 2:1. Maximum operating temperature is +250 F. Perfect for patching applications.

Buy Now Datasheet

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Industrial Sealants
Product Number 078143-13110
Product Name Devcon Floor Patch Base & Accelerator (B/A) Asphalt & Concrete Sealant - Gray Liquid 10 lb - 13110
Type / Form Liquid
Unlock Full Specs
to access all available technical data

Similar Products

Sealants - 9015708 - RS Components, Ltd.
RS Components, Ltd.
Specs
Type / Form Liquid
Chemical System Silicone
Industry Atmospheric moisture, corrosion sensitive devices, electrical & electronic applications, small circuits and connectors
View Details
KM 2740 Series -  - Beacon Adhesives, Inc.
Beacon Adhesives, Inc.
View Details
Liquid Gap Fillers for Electronics - Electrolube ® LGF400 Liquid Gap Filler - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Two Component  
Type / Form Liquid
Features Leveling Filling; Gap Filler, Foam in Place Gasket; Thermally Conductive
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Type / Form Liquid; Sheet or Film
Features EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive
Industry Electronics; Semiconductors, IC's
View Details