Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioni
| Accuris | |
|---|---|
| Product Category | Standards and Technical Documents |
| Product Number | TR-486 |
| Product Name | Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-Layer Seperations |