Accuris Thermal standardization on semiconductor packages Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages PD IEC TR 63378-1

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Thermal standardization on semiconductor packages Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
  • Thermal standardization on semiconductor packages Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages - PD IEC TR 63378-1 - Accuris
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Thermal standardization on semiconductor packages Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
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Thermal standardization on semiconductor packages Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages - PD IEC TR 63378-1 - Accuris
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Thermal standardization on semiconductor packages Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
PD IEC TR 63378-1
Thermal standardization on semiconductor packages Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages PD IEC TR 63378-1
Thermal standardization on semiconductor packages Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

Thermal standardization on semiconductor packages Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

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Technical Specifications

  Accuris
Product Category Standards and Technical Documents
Product Number PD IEC TR 63378-1
Product Name Thermal standardization on semiconductor packages Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
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