Accuris Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP) NAS4123

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Heat Sink, Electrical-Electroni c Component, Semiconductor Devices, for Dual Inline Packages (DIP)
  • Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP) - NAS4123 - Accuris
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Description
Heat Sink, Electrical-Electroni c Component, Semiconductor Devices, for Dual Inline Packages (DIP)
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Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP) - NAS4123 - Accuris
Accuris
Englewood, CO, United States
Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)
NAS4123
Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP) NAS4123
Heat Sink, Electrical-Electroni c Component, Semiconductor Devices, for Dual Inline Packages (DIP)

Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)

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Technical Specifications

  Accuris
Product Category Standards and Technical Documents
Product Number NAS4123
Product Name Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)
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