Accuris Thin Copper-Clad Laminates for Multilayer Printed Wiring Boards-Glass Fabric Base, Bismaleimide/Triazine/Epoxide JIS C 6494

Description
Thin Copper-Clad Laminates for Multilayer Printed Wiring Boards-Glass Fabric Base, Bismaleimide/Triazin e/Epoxide
  • Thin Copper-Clad Laminates for Multilayer Printed Wiring Boards-Glass Fabric Base, Bismaleimide/Triazine/Epoxide - JIS C 6494 - Accuris
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Description
Thin Copper-Clad Laminates for Multilayer Printed Wiring Boards-Glass Fabric Base, Bismaleimide/Triazin e/Epoxide
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Thin Copper-Clad Laminates for Multilayer Printed Wiring Boards-Glass Fabric Base, Bismaleimide/Triazine/Epoxide - JIS C 6494 - Accuris
Accuris
Englewood, CO, United States
Thin Copper-Clad Laminates for Multilayer Printed Wiring Boards-Glass Fabric Base, Bismaleimide/Triazine/Epoxide
JIS C 6494
Thin Copper-Clad Laminates for Multilayer Printed Wiring Boards-Glass Fabric Base, Bismaleimide/Triazine/Epoxide JIS C 6494
Thin Copper-Clad Laminates for Multilayer Printed Wiring Boards-Glass Fabric Base, Bismaleimide/Triazin e/Epoxide

Thin Copper-Clad Laminates for Multilayer Printed Wiring Boards-Glass Fabric Base, Bismaleimide/Triazine/Epoxide

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Technical Specifications

  Accuris
Product Category Standards and Technical Documents
Product Number JIS C 6494
Product Name Thin Copper-Clad Laminates for Multilayer Printed Wiring Boards-Glass Fabric Base, Bismaleimide/Triazine/Epoxide
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