Accuris Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages JESD217

Description
Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages
  • Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages - JESD217 - Accuris
    Accuris
Request a Quote
Description
Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages - JESD217 - Accuris
Accuris
Englewood, CO, United States
Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages
JESD217
Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages JESD217
Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages

Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages

Buy Now

Technical Specifications

  Accuris
Product Category Standards and Technical Documents
Product Number JESD217
Product Name Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages
Unlock Full Specs
to access all available technical data

Similar Products