Accuris Constant-Temperature Aging Method to Characterize Copper Interconnect Metallization for Stress-Induced Voiding JESD214.01

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Constant-Temperature Aging Method to Characterize Copper Interconnect Metallization for Stress-Induced Voiding
  • Constant-Temperature Aging Method to Characterize Copper Interconnect Metallization for Stress-Induced Voiding - JESD214.01 - Accuris
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Description
Constant-Temperature Aging Method to Characterize Copper Interconnect Metallization for Stress-Induced Voiding
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Constant-Temperature Aging Method to Characterize Copper Interconnect Metallization for Stress-Induced Voiding - JESD214.01 - Accuris
Accuris
Englewood, CO, United States
Constant-Temperature Aging Method to Characterize Copper Interconnect Metallization for Stress-Induced Voiding
JESD214.01
Constant-Temperature Aging Method to Characterize Copper Interconnect Metallization for Stress-Induced Voiding JESD214.01
Constant-Temperature Aging Method to Characterize Copper Interconnect Metallization for Stress-Induced Voiding

Constant-Temperature Aging Method to Characterize Copper Interconnect Metallization for Stress-Induced Voiding

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Technical Specifications

  Accuris
Product Category Standards and Technical Documents
Product Number JESD214.01
Product Name Constant-Temperature Aging Method to Characterize Copper Interconnect Metallization for Stress-Induced Voiding
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