Accuris Constant Temperature Aging to Characterize Aluminum Interconnect Metallization for Stress-Induced Voiding JEP139

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Constant Temperature Aging to Characterize Aluminum Interconnect Metallization for Stress-Induced Voiding
  • Constant Temperature Aging to Characterize Aluminum Interconnect Metallization for Stress-Induced Voiding - JEP139 - Accuris
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Description
Constant Temperature Aging to Characterize Aluminum Interconnect Metallization for Stress-Induced Voiding
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Constant Temperature Aging to Characterize Aluminum Interconnect Metallization for Stress-Induced Voiding - JEP139 - Accuris
Accuris
Englewood, CO, United States
Constant Temperature Aging to Characterize Aluminum Interconnect Metallization for Stress-Induced Voiding
JEP139
Constant Temperature Aging to Characterize Aluminum Interconnect Metallization for Stress-Induced Voiding JEP139
Constant Temperature Aging to Characterize Aluminum Interconnect Metallization for Stress-Induced Voiding

Constant Temperature Aging to Characterize Aluminum Interconnect Metallization for Stress-Induced Voiding

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Technical Specifications

  Accuris
Product Category Standards and Technical Documents
Product Number JEP139
Product Name Constant Temperature Aging to Characterize Aluminum Interconnect Metallization for Stress-Induced Voiding
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