Accuris STANDARD METHOD FOR MEASUREMENT OF OXIDE THICKNESS ON SILICON WAFERS AND METALLIZATION THICKNESS BY MULTIPLE- BEAM INTERFERENCE (TOLANSKY METHOD) F388

Description
STANDARD METHOD FOR MEASUREMENT OF OXIDE THICKNESS ON SILICON WAFERS AND METALLIZATION THICKNESS BY MULTIPLE- BEAM INTERFERENCE (TOLANSKY METHOD)
  • STANDARD METHOD FOR MEASUREMENT OF OXIDE THICKNESS ON SILICON WAFERS AND METALLIZATION THICKNESS BY MULTIPLE- BEAM INTERFERENCE (TOLANSKY METHOD) - F388 - Accuris
    Accuris
Request a Quote
Description
STANDARD METHOD FOR MEASUREMENT OF OXIDE THICKNESS ON SILICON WAFERS AND METALLIZATION THICKNESS BY MULTIPLE- BEAM INTERFERENCE (TOLANSKY METHOD)
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
STANDARD METHOD FOR MEASUREMENT OF OXIDE THICKNESS ON SILICON WAFERS AND METALLIZATION THICKNESS BY MULTIPLE- BEAM INTERFERENCE (TOLANSKY METHOD) - F388 - Accuris
Accuris
Englewood, CO, United States
STANDARD METHOD FOR MEASUREMENT OF OXIDE THICKNESS ON SILICON WAFERS AND METALLIZATION THICKNESS BY MULTIPLE- BEAM INTERFERENCE (TOLANSKY METHOD)
F388
STANDARD METHOD FOR MEASUREMENT OF OXIDE THICKNESS ON SILICON WAFERS AND METALLIZATION THICKNESS BY MULTIPLE- BEAM INTERFERENCE (TOLANSKY METHOD) F388
STANDARD METHOD FOR MEASUREMENT OF OXIDE THICKNESS ON SILICON WAFERS AND METALLIZATION THICKNESS BY MULTIPLE- BEAM INTERFERENCE (TOLANSKY METHOD)

STANDARD METHOD FOR MEASUREMENT OF OXIDE THICKNESS ON SILICON WAFERS AND METALLIZATION THICKNESS BY MULTIPLE- BEAM INTERFERENCE (TOLANSKY METHOD)

Buy Now

Technical Specifications

  Accuris
Product Category Standards and Technical Documents
Product Number F388
Product Name STANDARD METHOD FOR MEASUREMENT OF OXIDE THICKNESS ON SILICON WAFERS AND METALLIZATION THICKNESS BY MULTIPLE- BEAM INTERFERENCE (TOLANSKY METHOD)
Unlock Full Specs
to access all available technical data

Similar Products