Accuris Standard Specification for High-Purity Copper Sputtering Target Used for Through- Silicon Vias (TSV) Mettalization F3192

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Standard Specification for High-Purity Copper Sputtering Target Used for Through- Silicon Vias (TSV) Mettalization
  • Standard Specification for High-Purity Copper Sputtering Target Used for Through- Silicon Vias (TSV) Mettalization - F3192 - Accuris
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Description
Standard Specification for High-Purity Copper Sputtering Target Used for Through- Silicon Vias (TSV) Mettalization
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Standard Specification for High-Purity Copper Sputtering Target Used for Through- Silicon Vias (TSV) Mettalization - F3192 - Accuris
Accuris
Englewood, CO, United States
Standard Specification for High-Purity Copper Sputtering Target Used for Through- Silicon Vias (TSV) Mettalization
F3192
Standard Specification for High-Purity Copper Sputtering Target Used for Through- Silicon Vias (TSV) Mettalization F3192
Standard Specification for High-Purity Copper Sputtering Target Used for Through- Silicon Vias (TSV) Mettalization

Standard Specification for High-Purity Copper Sputtering Target Used for Through- Silicon Vias (TSV) Mettalization

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Technical Specifications

  Accuris
Product Category Standards and Technical Documents
Product Number F3192
Product Name Standard Specification for High-Purity Copper Sputtering Target Used for Through- Silicon Vias (TSV) Mettalization
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