Accuris Semiconductor devices - Micro-electromechanical devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates EN 62047-22

Description
Semiconductor devices - Micro-electromechani cal devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Request a Quote
Description
Semiconductor devices - Micro-electromechani cal devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Semiconductor devices - Micro-electromechanical devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates - EN 62047-22 - Accuris
Englewood, CO, United States
Semiconductor devices - Micro-electromechanical devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
EN 62047-22
Semiconductor devices - Micro-electromechanical devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates EN 62047-22
Semiconductor devices - Micro-electromechani cal devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

Semiconductor devices - Micro-electromechanical devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

Buy Now

Technical Specifications

  Accuris
Product Category Standards and Technical Documents
Product Number EN 62047-22
Product Name Semiconductor devices - Micro-electromechanical devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Unlock Full Specs
to access all available technical data

Similar Products