Accuris Mechanical standardization of semiconductor devices Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package... EN 60191-6-20

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Mechanical standardization of semiconductor devices Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
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Description
Mechanical standardization of semiconductor devices Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
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Mechanical standardization of semiconductor devices Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package... - EN 60191-6-20 - Accuris
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Mechanical standardization of semiconductor devices Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package...
EN 60191-6-20
Mechanical standardization of semiconductor devices Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package... EN 60191-6-20
Mechanical standardization of semiconductor devices Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

Mechanical standardization of semiconductor devices Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

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  Accuris
Product Category Standards and Technical Documents
Product Number EN 60191-6-20
Product Name Mechanical standardization of semiconductor devices Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package...
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