Accuris Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials DS/EN 62047-18

Description
Semiconductor devices - Micro-electromechani cal devices - Part 18: Bend testing methods of thin film materials
Request a Quote
Description
Semiconductor devices - Micro-electromechani cal devices - Part 18: Bend testing methods of thin film materials
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials - DS/EN 62047-18 - Accuris
Englewood, CO, United States
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
DS/EN 62047-18
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials DS/EN 62047-18
Semiconductor devices - Micro-electromechani cal devices - Part 18: Bend testing methods of thin film materials

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

Buy Now

Technical Specifications

  Accuris
Product Category Standards and Technical Documents
Product Number DS/EN 62047-18
Product Name Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Unlock Full Specs
to access all available technical data

Similar Products