Accuris Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method DS/EN 61191-6

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Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
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Description
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
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Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method - DS/EN 61191-6 - Accuris
Englewood, CO, United States
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
DS/EN 61191-6
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method DS/EN 61191-6
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

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Technical Specifications

  Accuris
Product Category Standards and Technical Documents
Product Number DS/EN 61191-6
Product Name Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
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