Accuris Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat DS/EN 60749-20

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Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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Description
Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - DS/EN 60749-20 - Accuris
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Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
DS/EN 60749-20
Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat DS/EN 60749-20
Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

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Technical Specifications

  Accuris
Product Category Standards and Technical Documents
Product Number DS/EN 60749-20
Product Name Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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