Accuris Semiconductor devices \x97 Micro-electromechanical devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates BS EN 62047-22

Description
Semiconductor devices \x97 Micro-electromechani cal devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Request a Quote
Description
Semiconductor devices \x97 Micro-electromechani cal devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Semiconductor devices \x97 Micro-electromechanical devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates - BS EN 62047-22 - Accuris
Englewood, CO, United States
Semiconductor devices \x97 Micro-electromechanical devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
BS EN 62047-22
Semiconductor devices \x97 Micro-electromechanical devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates BS EN 62047-22
Semiconductor devices \x97 Micro-electromechani cal devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

Semiconductor devices \x97 Micro-electromechanical devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

Buy Now

Technical Specifications

  Accuris
Product Category Standards and Technical Documents
Product Number BS EN 62047-22
Product Name Semiconductor devices \x97 Micro-electromechanical devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Unlock Full Specs
to access all available technical data

Similar Products