Accuris Semiconductor devices - Micro-electromechanical devices Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures BS EN 62047-12

Description

Semiconductor devices - Micro-electromechani cal devices Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

Accuris

Request a Quote

Email Supplier

Description

Semiconductor devices - Micro-electromechani cal devices Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

Request a Quote

Email Supplier

Suppliers

Company

Product

Description

Supplier Links

Semiconductor devices - Micro-electromechanical devices Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures - BS EN 62047-12 - Accuris

Accuris

Englewood, CO, United States

Semiconductor devices - Micro-electromechanical devices Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
BS EN 62047-12

Semiconductor devices - Micro-electromechanical devices Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures BS EN 62047-12

Semiconductor devices - Micro-electromechani cal devices Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

Buy Now

Technical Specifications

	Accuris
Product Category	Standards and Technical Documents
Product Number	BS EN 62047-12
Product Name	Semiconductor devices - Micro-electromechanical devices Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures