Accuris Specification for Metal-Clad Base Materials For Printed Circuits Part 11: Bonding Sheet Material for Use in the Fabrication of Multi-Layer Printed Boards: EP-GC-11 BS 4584-11

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Specification for Metal-Clad Base Materials For Printed Circuits Part 11: Bonding Sheet Material for Use in the Fabrication of Multi-Layer Printed Boards: EP-GC-11
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Description
Specification for Metal-Clad Base Materials For Printed Circuits Part 11: Bonding Sheet Material for Use in the Fabrication of Multi-Layer Printed Boards: EP-GC-11
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Specification for Metal-Clad Base Materials For Printed Circuits Part 11: Bonding Sheet Material for Use in the Fabrication of Multi-Layer Printed Boards: EP-GC-11 - BS 4584-11 - Accuris
Englewood, CO, United States
Specification for Metal-Clad Base Materials For Printed Circuits Part 11: Bonding Sheet Material for Use in the Fabrication of Multi-Layer Printed Boards: EP-GC-11
BS 4584-11
Specification for Metal-Clad Base Materials For Printed Circuits Part 11: Bonding Sheet Material for Use in the Fabrication of Multi-Layer Printed Boards: EP-GC-11 BS 4584-11
Specification for Metal-Clad Base Materials For Printed Circuits Part 11: Bonding Sheet Material for Use in the Fabrication of Multi-Layer Printed Boards: EP-GC-11

Specification for Metal-Clad Base Materials For Printed Circuits Part 11: Bonding Sheet Material for Use in the Fabrication of Multi-Layer Printed Boards: EP-GC-11

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Technical Specifications

  Accuris
Product Category Standards and Technical Documents
Product Number BS 4584-11
Product Name Specification for Metal-Clad Base Materials For Printed Circuits Part 11: Bonding Sheet Material for Use in the Fabrication of Multi-Layer Printed Boards: EP-GC-11
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