Accuris Mechanical Standardization of Semiconductor Devices Part 5: Recommendations for Tape Automated Bonding (TAB) of Integrated Circuits BS 3934-5

Description
Mechanical Standardization of Semiconductor Devices Part 5: Recommendations for Tape Automated Bonding (TAB) of Integrated Circuits
  • Mechanical Standardization of Semiconductor Devices Part 5: Recommendations for Tape Automated Bonding (TAB) of Integrated Circuits - BS 3934-5 - Accuris
    Accuris
Request a Quote
Description
Mechanical Standardization of Semiconductor Devices Part 5: Recommendations for Tape Automated Bonding (TAB) of Integrated Circuits
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Mechanical Standardization of Semiconductor Devices Part 5: Recommendations for Tape Automated Bonding (TAB) of Integrated Circuits - BS 3934-5 - Accuris
Accuris
Englewood, CO, United States
Mechanical Standardization of Semiconductor Devices Part 5: Recommendations for Tape Automated Bonding (TAB) of Integrated Circuits
BS 3934-5
Mechanical Standardization of Semiconductor Devices Part 5: Recommendations for Tape Automated Bonding (TAB) of Integrated Circuits BS 3934-5
Mechanical Standardization of Semiconductor Devices Part 5: Recommendations for Tape Automated Bonding (TAB) of Integrated Circuits

Mechanical Standardization of Semiconductor Devices Part 5: Recommendations for Tape Automated Bonding (TAB) of Integrated Circuits

Buy Now

Technical Specifications

  Accuris
Product Category Standards and Technical Documents
Product Number BS 3934-5
Product Name Mechanical Standardization of Semiconductor Devices Part 5: Recommendations for Tape Automated Bonding (TAB) of Integrated Circuits
Unlock Full Specs
to access all available technical data

Similar Products