Accuris Semiconductor devices \x96 Micro-electromechanical devices \x96 Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection 62047-38

Description
Semiconductor devices \x96 Micro-electromechani cal devices \x96 Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
  • Semiconductor devices \x96 Micro-electromechanical devices \x96 Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection - 62047-38 - Accuris
    Accuris
Request a Quote
Description
Semiconductor devices \x96 Micro-electromechani cal devices \x96 Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Semiconductor devices \x96 Micro-electromechanical devices \x96 Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection - 62047-38 - Accuris
Accuris
Englewood, CO, United States
Semiconductor devices \x96 Micro-electromechanical devices \x96 Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
62047-38
Semiconductor devices \x96 Micro-electromechanical devices \x96 Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection 62047-38
Semiconductor devices \x96 Micro-electromechani cal devices \x96 Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

Semiconductor devices \x96 Micro-electromechanical devices \x96 Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

Buy Now

Technical Specifications

  Accuris
Product Category Standards and Technical Documents
Product Number 62047-38
Product Name Semiconductor devices \x96 Micro-electromechanical devices \x96 Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
Unlock Full Specs
to access all available technical data

Similar Products