Accuris Semiconductor devices \x96 Micro-electromechanical devices \x96 Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures 62047-13

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Semiconductor devices \x96 Micro-electromechani cal devices \x96 Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
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Description
Semiconductor devices \x96 Micro-electromechani cal devices \x96 Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
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Semiconductor devices \x96 Micro-electromechanical devices \x96 Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures - 62047-13 - Accuris
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Semiconductor devices \x96 Micro-electromechanical devices \x96 Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
62047-13
Semiconductor devices \x96 Micro-electromechanical devices \x96 Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures 62047-13
Semiconductor devices \x96 Micro-electromechani cal devices \x96 Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

Semiconductor devices \x96 Micro-electromechanical devices \x96 Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

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  Accuris
Product Category Standards and Technical Documents
Product Number 62047-13
Product Name Semiconductor devices \x96 Micro-electromechanical devices \x96 Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
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