Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)
| Accuris | |
|---|---|
| Product Category | Standards and Technical Documents |
| Product Number | 60191-6-4 |
| Product Name | Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package di... |
