Accuris Mechanical standardization of semiconductor devices \x96 Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage 60191-6-19

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Mechanical standardization of semiconductor devices \x96 Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
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Mechanical standardization of semiconductor devices \x96 Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
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Mechanical standardization of semiconductor devices \x96 Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage - 60191-6-19 - Accuris
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Mechanical standardization of semiconductor devices \x96 Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
60191-6-19
Mechanical standardization of semiconductor devices \x96 Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage 60191-6-19
Mechanical standardization of semiconductor devices \x96 Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Mechanical standardization of semiconductor devices \x96 Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

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  Accuris
Product Category Standards and Technical Documents
Product Number 60191-6-19
Product Name Mechanical standardization of semiconductor devices \x96 Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
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