Hernon Manufacturing, Inc. Formulations - Applications - Bonding - Tuffbond 321 3321AB22

Description
Tuffbond® 321 is a flexible, low viscosity, general purpose resin system used for casting, potting, and encapsulating of electrical and electronic components. This unique product has been formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties.
Datasheet
Description
Tuffbond® 321 is a flexible, low viscosity, general purpose resin system used for casting, potting, and encapsulating of electrical and electronic components. This unique product has been formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Formulations - Applications - Bonding - Tuffbond 321 - 3321AB22 - Hernon Manufacturing, Inc.
Sanford, FL, United States
Formulations - Applications - Bonding - Tuffbond 321
3321AB22
Formulations - Applications - Bonding - Tuffbond 321 3321AB22
Tuffbond® 321 is a flexible, low viscosity, general purpose resin system used for casting, potting, and encapsulating of electrical and electronic components. This unique product has been formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties.

Tuffbond® 321 is a flexible, low viscosity, general purpose resin system used for casting, potting, and encapsulating of electrical and electronic components. This unique product has been formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties.

Supplier's Site Datasheet

Technical Specifications

  Hernon Manufacturing, Inc.
Product Category Industrial Adhesives
Product Number 3321AB22
Product Name Formulations - Applications - Bonding - Tuffbond 321
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
Unlock Full Specs
to access all available technical data

Similar Products

Formulations - Applications - Bonding - HASA 716 - 371630 - Hernon Manufacturing, Inc.
Specs
Cure / Technology Single Component
Chemical System Acrylic
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Formulations - Applications - Impregnation - HPS 994 - 3994M75 - Hernon Manufacturing, Inc.
Specs
Cure / Technology Thermoset
Chemical System Ceramic
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Formulations - Applications - Bonding - HASA 722 - 372230 - Hernon Manufacturing, Inc.
Specs
Cure / Technology Thermoset; Single Component
Chemical System Ceramic
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Formulations - Applications - Retaining Compounds - Cylinlock 842 - 3842HV60 - Hernon Manufacturing, Inc.
Specs
Features Threadlocker or Retainer
Substrate Compatibility Metal; Metallic or non-metallic substrates
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details