Bergquist Company (The) Gap Pad, Vo Soft; Thermal Conductivity Bergquist BG405792

Description
GAP PAD, VO SOFT; Thermal Conductivity:0.8W/m. K; Conductive Material:Filled Silicone Polymer; Thickness:5.08mm; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:100mm; Product Range:-; Overall Width:100mmRoHS Compliant: Yes
  • Gap Pad, Vo Soft; Thermal Conductivity Bergquist - 18J2198 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
GAP PAD, VO SOFT; Thermal Conductivity:0.8W/m. K; Conductive Material:Filled Silicone Polymer; Thickness:5.08mm; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:100mm; Product Range:-; Overall Width:100mmRoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Gap Pad, Vo Soft; Thermal Conductivity Bergquist - 18J2198 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Gap Pad, Vo Soft; Thermal Conductivity Bergquist
18J2198
Gap Pad, Vo Soft; Thermal Conductivity Bergquist 18J2198
GAP PAD, VO SOFT; Thermal Conductivity:0.8W/m. K; Conductive Material:Filled Silicone Polymer; Thickness:5.08mm; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:100mm; Product Range:-; Overall Width:100mmRoHS Compliant: Yes

GAP PAD, VO SOFT; Thermal Conductivity:0.8W/m.K; Conductive Material:Filled Silicone Polymer; Thickness:5.08mm; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:100mm; Product Range:-; Overall Width:100mmRoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 18J2198
Product Name Gap Pad, Vo Soft; Thermal Conductivity Bergquist
Thermal Conductivity 0.8000 W/m-K (0.4622 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Two Component Silver Conductive Epoxy - EP77M-1 - Master Bond, Inc.
Master Bond, Inc.
Two Component Silver Conductive Epoxy
EP77M-1
Specs
Cure / Technology Thermoset; Two Component  
Form / Shape Grease, Paste; Gap Filler, Foam in Place Gasket
Chemical System Epoxy
View Details
Highly Thermally Conductive, Non-reactive Silicone-based Grease - SARCON ® SG07SL - Fujipoly® America Corp.
Fujipoly® America Corp.
Highly Thermally Conductive, Non-reactive Silicone-based Grease
SARCON ® SG07SL
Specs
Form / Shape Grease, Paste
Chemical System Silicone
Industry Electronics; Semiconductors, IC's
View Details
1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed - AS1707 - CHT USA Inc.
CHT USA Inc.
1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed
AS1707
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Industry Automotive; Electronics
View Details