Henkel North America 291347

Extruded solder containing 60% tin and 40% lead which is ideal for solder baths or pots. The high purity and lack of undesirable elements gives less dross on initial melting, more solder joints weight for weight, improved wetting of electronic components and PCBs and more uniform results. Approximate melting point 183-215°C. Stick weight 80 g Wire Diameter = 7mm Percent Lead = 40% Product Form = Stick Melting Point = +183 - +215°C Percent Tin = 60% Product Weight = 80g