Loctite UK Loctite Fixmaster Yellow Epoxy Adhesive - Yellow - Base & Accelerator (B/A) - 1 gal Kit Fixmaster 1633970

Description
Loctite Fixmaster yellow epoxy adhesive is compatible with concrete materials with a 72 hr cure time.
  • Loctite Fixmaster Yellow Epoxy Adhesive - Yellow - Base & Accelerator (B/A) - 1 gal Kit Fixmaster - 079340-00243 - R. S. Hughes Company, Inc.
    R. S. Hughes Company, Inc.
Description
Loctite Fixmaster yellow epoxy adhesive is compatible with concrete materials with a 72 hr cure time.

Suppliers

Company
Product
Description
Supplier Links
Loctite Fixmaster Yellow Epoxy Adhesive - Yellow - Base & Accelerator (B/A) - 1 gal Kit Fixmaster - 079340-00243 - R. S. Hughes Company, Inc.
R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Loctite Fixmaster Yellow Epoxy Adhesive - Yellow - Base & Accelerator (B/A) - 1 gal Kit Fixmaster
079340-00243
Loctite Fixmaster Yellow Epoxy Adhesive - Yellow - Base & Accelerator (B/A) - 1 gal Kit Fixmaster 079340-00243
Loctite Fixmaster yellow epoxy adhesive is compatible with concrete materials with a 72 hr cure time.

Loctite Fixmaster yellow epoxy adhesive is compatible with concrete materials with a 72 hr cure time.

Buy Now

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Industrial Adhesives
Product Number 079340-00243
Product Name Loctite Fixmaster Yellow Epoxy Adhesive - Yellow - Base & Accelerator (B/A) - 1 gal Kit Fixmaster
Chemical System Epoxy
Unlock Full Specs
to access all available technical data

Similar Products

Fluon® Perfluoro Adhesive - EA-2000 - AGC Chemicals Americas, Inc.
AGC Chemicals Americas, Inc.
Fluon® Perfluoro Adhesive
EA-2000
Specs
Chemical System PFA
Type / Form Pellets
Features Laminaes
View Details
Sn63 Pb37 58 Core 285 Flux Rohs Compliant Kester Solder - 91B4798 - Newark, An Avnet Company
MacDermid Alpha Electronics Solutions
Sn63 Pb37 58 Core 285 Flux Rohs Compliant Kester Solder
24-6337-9700
View Details
Thermal pad for chipset - SF800 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Thermal pad for chipset
SF800
Specs
Features Thermally Conductive
Industry Electronics
Use Temperature -58 to 302 F (-50 to 150 C)
View Details
Light-Curable Materials, Dissimilar Substrate Bonding, 6-630-T - - Dymax
Dymax
Light-Curable Materials, Dissimilar Substrate Bonding, 6-630-T
Specs
Cure / Technology UV or Radiation Cured
Substrate Compatibility Ceramic, Glass; Metal; Dissimilar Substrates; ABS; PEEK; PEI; PSU; PVC; AL; Stainless Steel; Glass
Industry automotive latch assembly, potting, and bonding glass fixtures and furniture.
View Details