The SG060250D-18 is a D-shaped fingerstock gasket designed for effective RFI and EMI shielding applications. It measures 0.060 inches in height, 0.250 inches in width, and 18 inches in length. This product is constructed from beryllium copper, which provides excellent conductivity and durability. It is suitable for various environments and can be used in applications requiring reliable shielding against electromagnetic interference. The gasket's design allows for effective compression and deflection, ensuring a secure fit in enclosures. This product is ideal for engineers seeking a robust solution for EMI/RFI protection in their projects.
.060"H X .250"W X 18"L--D SHAPED
.060"H X .250"W X 18"L--D SHAPED
| Quarktwin Technology Ltd. | Acme Chip Technology Co., Limited | |
|---|---|---|
| Product Category | Electrodes and Electrode Materials | Electrodes and Electrode Materials |
| Product Number | SG060250D-18 | SG060250D-18 |
| Product Name | RFI and EMI - Contacts, Fingerstock and Gaskets | RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets |
| Type | Contact; Fabric Over Foam |
