Leader Tech, Inc. RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets 5409-0004-60-300

Description
NI/C FILLED SILICONE; 0.125" X .
  • RFI and EMI - Contacts, Fingerstock and Gaskets - 5409-0004-60-300 - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
Datasheet
Description
NI/C FILLED SILICONE; 0.125" X .
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Acme Chip Technology Co., Limited
Shenzhen, China
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets
5409-0004-60-300
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets 5409-0004-60-300
NI/C FILLED SILICONE; 0.125" X .

NI/C FILLED SILICONE; 0.125" X .

Supplier's Site
RFI and EMI - Contacts, Fingerstock and Gaskets - 5409-0004-60-300 - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
RFI and EMI - Contacts, Fingerstock and Gaskets
5409-0004-60-300
RFI and EMI - Contacts, Fingerstock and Gaskets 5409-0004-60-300
NI/C FILLED SILICONE; 0.125" X .

NI/C FILLED SILICONE; 0.125" X .

Buy Now Datasheet

Technical Specifications

  Acme Chip Technology Co., Limited Quarktwin Technology Ltd.
Product Category Electrodes and Electrode Materials Electrodes and Electrode Materials
Product Number 5409-0004-60-300 5409-0004-60-300
Product Name RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets RFI and EMI - Contacts, Fingerstock and Gaskets
Shape / Form Gasket
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