Harwin Plc Rectangle SMT Contact Pad, 3.80 x 1.80mm, 0.1mm thick (T+R) S70-138181045R

Harwin Plc
Win Source Electronics

Description

Surface Mount flat contact pad, rectangular shape. Gold finish. 3.8mm x 1.8mm rectangle, 0.1mm thick. Use as a hard-wearing mating surface for SMT Spring Contacts, Spring Loaded Contacts and Spring Loaded Contact Assemblies.

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Harwin Plc

Portsmouth, United Kingdom

Rectangle SMT Contact Pad, 3.80 x 1.80mm, 0.1mm thick (T+R)
S70-138181045R

Rectangle SMT Contact Pad, 3.80 x 1.80mm, 0.1mm thick (T+R) S70-138181045R

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Win Source Electronics

Yishun, Singapore

Connectors, Interconnects -Contacts -Contacts, Spring Loaded (Pogo Pins), and Pressure
S70-138181045R

Connectors, Interconnects -Contacts -Contacts, Spring Loaded (Pogo Pins), and Pressure S70-138181045R

Manufacturer: Harwin Inc. Category: Connectors, Interconnects -Contacts -Contacts, Spring Loaded (Pogo Pins), and Pressure Package: Tape & Reel (TR) Cut Tape (CT) Product Status: Active Contact Type: Contact Pad Mounting Type: Surface Mount Pad Layout Dimension: Rectangular - 0.150" L x 0.071" W x 0.004" H (3.80mm x 1.80mm x 0.10mm) Contact Material: Beryllium Copper Contact Finish: Gold Operating Temperature: -40°C ~ 180°C

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Technical Specifications

	Harwin Plc	Win Source Electronics
Product Category	Electrical Contacts	Electrical Contacts
Product Number	S70-138181045R	S70-138181045R
Product Name	Rectangle SMT Contact Pad, 3.80 x 1.80mm, 0.1mm thick (T+R)	Connectors, Interconnects -Contacts -Contacts, Spring Loaded (Pogo Pins), and Pressure
Shape / Form	Rectangular shape	Stamping
Features	RoHS Compliant (2015/863/EU) with no Exemption required
Contact Material	Gold or Gold Alloy	Cu; Beryllium Copper
Thickness	0.0039 inch (0.1000 mm)