H. B. Fuller Company HB Fuller Cyberbond Apollo 2300 Cyanoacrylate Adhesive Clear 454 g Bottle 15006078

Description
HB Fuller Cyberbond Apollo 2300 Cyanoacrylate Adhesive Clear is a one component adhesive for general purpose use. It has extended repositioning time and offers maximum gap-filling characteristics. 454 g Bottle.
Request a Quote Datasheet
Description
HB Fuller Cyberbond Apollo 2300 Cyanoacrylate Adhesive Clear is a one component adhesive for general purpose use. It has extended repositioning time and offers maximum gap-filling characteristics. 454 g Bottle.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
HB Fuller Cyberbond Apollo 2300 Cyanoacrylate Adhesive Clear 454 g Bottle - 2300 454 GRAM BOTTLE - Ellsworth Adhesives
Germantown, WI, USA
HB Fuller Cyberbond Apollo 2300 Cyanoacrylate Adhesive Clear 454 g Bottle
2300 454 GRAM BOTTLE
HB Fuller Cyberbond Apollo 2300 Cyanoacrylate Adhesive Clear 454 g Bottle 2300 454 GRAM BOTTLE
HB Fuller Cyberbond Apollo 2300 Cyanoacrylate Adhesive Clear is a one component adhesive for general purpose use. It has extended repositioning time and offers maximum gap-filling characteristics. 454 g Bottle.

HB Fuller Cyberbond Apollo 2300 Cyanoacrylate Adhesive Clear is a one component adhesive for general purpose use. It has extended repositioning time and offers maximum gap-filling characteristics. 454 g Bottle.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number 2300 454 GRAM BOTTLE
Product Name HB Fuller Cyberbond Apollo 2300 Cyanoacrylate Adhesive Clear 454 g Bottle
Cure / Technology Single Component
Unlock Full Specs
to access all available technical data

Similar Products

Fiber Adhesive -  - Beijing Grish Hitech Co., Ltd.
Beijing Grish Hitech Co., Ltd.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Type / Form Liquid
View Details
UV-Curing Epoxy, NOA 86, 6 gm Syringe - NOA-86S - Newport MKS
Specs
Cure / Technology UV or Radiation Cured
Chemical System Epoxy
View Details
High thermal conductivity carbon fiber heat sink soft thermal pad thermal gap filler for electronic devices - CSF30 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Features Thermally Conductive
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details