H. B. Fuller Company HB Fuller Advantra® PHC9254 Hot Melt Adhesive Pellets Light Amber 38 lb Case 15001495

Description
HB Fuller Advantra® PHC9254 is a one component, general purpose hot melt adhesive with a medium set speed. Typical substrates include uncoated to moderately coated corrugated, clay, SUS, SBS, and similar materials. Light Amber, 38 lb Case.
  • HB Fuller Advantra® PHC9254 Hot Melt Adhesive Pellets Light Amber 38 lb Case - PHC9254PE 38LB PELLETS - Ellsworth Adhesives
    Ellsworth Adhesives
Request a Quote Datasheet
Description
HB Fuller Advantra® PHC9254 is a one component, general purpose hot melt adhesive with a medium set speed. Typical substrates include uncoated to moderately coated corrugated, clay, SUS, SBS, and similar materials. Light Amber, 38 lb Case.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
HB Fuller Advantra® PHC9254 Hot Melt Adhesive Pellets Light Amber 38 lb Case - PHC9254PE 38LB PELLETS - Ellsworth Adhesives
Ellsworth Adhesives
Germantown, WI, USA
HB Fuller Advantra® PHC9254 Hot Melt Adhesive Pellets Light Amber 38 lb Case
PHC9254PE 38LB PELLETS
HB Fuller Advantra® PHC9254 Hot Melt Adhesive Pellets Light Amber 38 lb Case PHC9254PE 38LB PELLETS
HB Fuller Advantra® PHC9254 is a one component, general purpose hot melt adhesive with a medium set speed. Typical substrates include uncoated to moderately coated corrugated, clay, SUS, SBS, and similar materials. Light Amber, 38 lb Case.

HB Fuller Advantra® PHC9254 is a one component, general purpose hot melt adhesive with a medium set speed. Typical substrates include uncoated to moderately coated corrugated, clay, SUS, SBS, and similar materials. Light Amber, 38 lb Case.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number PHC9254PE 38LB PELLETS
Product Name HB Fuller Advantra® PHC9254 Hot Melt Adhesive Pellets Light Amber 38 lb Case
Cure / Technology Thermoplastic / Hot Melt; Single Component
Unlock Full Specs
to access all available technical data

Similar Products

Epoxy,epo-Tek 353Nd,4Gm Amp Te Connectivity - 83T0049 - Newark, An Avnet Company
TE Connectivity
Epoxy,epo-Tek 353Nd,4Gm Amp Te Connectivity
504035-1
View Details
Ultra-high thermal conductivity thermal gel - SE50 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Ultra-high thermal conductivity thermal gel
SE50
Specs
Chemical System Silicone
Type / Form Gel
Features Thermally Conductive
View Details
Light-Curable Materials, Dissimilar Substrate Bonding, 9701 - - Dymax
Dymax
Light-Curable Materials, Dissimilar Substrate Bonding, 9701
Specs
Cure / Technology UV or Radiation Cured
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Dissimilar Substrates; Glass; PET
View Details
High-Reliability Thermoplastic Adhesives for Microelectronics - STAYSTIK ® 672 - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
High-Reliability Thermoplastic Adhesives for Microelectronics
STAYSTIK ® 672
Specs
Cure / Technology Thermoplastic / Hot Melt; Thermoset
Type / Form Sheet or Film
Features Thermally Conductive
View Details