SRAM 2.5 or 3.3V 512K x 32 16M Product overview: GS8161Z32DGD-150 from GSI Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 3.3V. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 3.3V, Memory IC and Storage Component, Memory Card, Module Accessories. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 500-GS8161Z32DGD-150
Manufacturer: GSI Technology
Storage Condition: Dry storage cabinet & Humidity protection package
Win Source Part Number: 1007761-GS8161Z32DGD
Packaging: Bulk
Number of Ports: 4
Mounting: SMD (SMT)
Density: 18 Mb
Number of Pins: 165
Categories: RAM
Case / Package: FBGA
Alternative Parts (Cross-Reference): CY7C1911KV18-250BZC;
Popularity: Low
Fake Threat In the Open Market: 66 pct.
Supply and Demand Status: Shortage
Maximum Operating Temperature: 70 °C
RoHS: Compliant
Radiation Hardening: No
Min Operating Temperature: 0 °C
Address Bus Width: 19 b
| ERSAELECTRONICS PTE. LTD. | Win Source Electronics | |
|---|---|---|
| Product Category | Memory Chips | Memory Chips |
| Product Number | 500-GS8161Z32DGD-150 | 1007761-GS8161Z32DGD-150 |
| Product Name | 3.3V Memory IC and Storage Component | Memory - RAM - GS8161Z32DGD-150 |
| Memory Category | SDR; SRAM Chip | SRAM Chip |
| Access Time | 7.5 ns | |
| Operating Temperature | 0 C (32 F) | 0 C (32 F) |
| Package Type | BGA; Tray | BGA; FBGA |
