Manufacturer: GigaDevice Semiconductor
Win Source Part Number: 919580-GD25LX256EBIR
Operating Temperature Range: -40°C ~ 85°C (TA)
Features: FLASH - NOR Memory IC 256Mb (32M x 8) SPI - Octal I/O 24-TFBGA (6x8)
Package: 24-TBGA
Package: Tray
Mounting: Surface Mount
Family Name: GD25LX256
Categories: Integrated Circuits (ICs)
Case / Package: 24-TFBGA (6x8)
ECCN: EAR99
Popularity: High
Fake Threat In the Open Market: 74 pct.
Supply and Demand Status: Balance
Quantity per package: 4800
MSL Level: 3 (168 Hours)
Estimated Pruduction Lead Time: 19 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.32.0071
Other Part Number: 1970-1090-2, 1970-1090-1, 1970-1090-1INACTIVE,
FLASH - NOR Memory IC 256Mb (32M x 8) SPI - Octal I/O 200MHz 24-TFBGA (6x8)
IC FLSH 256MBIT SPI/OCTL 24TFBGA
IC FLSH 256MBIT SPI/OCTL 24TFBGA
FLASH - NOR Memory IC 256Mbit SPI - Octal I/O 200 MHz 24-TFBGA (6x8)
| Win Source Electronics | DigiKey | Lingto Electronic Limited | Shenzhen Shengyu Electronics Technology Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 919580-GD25LX256EBIRY | 1970-GD25LX256EBIRY-ND | GD25LX256EBIRY | GD25LX256EBIRY | GD25LX256EBIRY |
| Product Name | Memory - Unclassified Memory - GD25LX256EBIRY | Memory | Memory | Integrated Circuits (ICs) - Memory - Memory | Memory |
| Operating Temperature | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) |
