The GD25LQ255EWIGR is a 256Mbit NOR Flash memory device from Quarktwin Technology Ltd. It supports both Dual and Quad Serial Peripheral Interface (SPI) modes, enabling high-speed data transfer rates up to 133 MHz. The memory organization features uniform sectors, which can facilitate efficient data management and programming. This device is designed for applications requiring fast read and write operations, with capabilities for various command operations including page programming, sector erase, and chip erase. It also includes data protection features to ensure data integrity during operations. The GD25LQ255EWIGR is available in multiple package options, including WSON and TFBGA, allowing for flexibility in design integration. Engineers considering this memory solution should evaluate its specifications against their project requirements, particularly in terms of speed, capacity, and operational modes.
Win Source Part Number: 1353621-GD25LQ255EWI
Category: Integrated Circuits (ICs) - Memory - Memory
Temperature Range - Operating: -40°C ~ 85°C (TA)
Fake Threat In the Open Market: 40 pct.
MSL Level: 3 (168 Hours)
Mfr: GigaDevice Semiconductor (HK) Limited
Package: Tape & Reel
Product Status: Active
Package / Case: 8-WDFN Exposed Pad
Supplier Device Package: 8-WSON (5x6)
Technology: FLASH - NOR (SLC)
Mounting Type: Surface Mount
HTSUS: 8542.32.0071
ECCN: 3A991B1A
Voltage - Supply: 1.65V ~ 2V
Memory Type: Non-Volatile
Memory Format: FLASH
Memory Size: 256Mbit
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O, QPI
Clock Frequency: 133 MHz
Write Cycle Time - Word, Page: 60µs, 2.4ms
Access Time: 6 ns
256MB, 1.8V, SPI NOR, WSON8 Product overview: GD25LQ255EWIGR from GigaDevice is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 256MB, 1.8V. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 256MB, 1.8V, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-GD25LQ255EWIGR can be used for catalog matching and distributor lookup.
IC FLASH 256MBIT SPI/QUAD
IC FLASH 256MBIT SPI/QUAD
IC FLASH 256MBIT SPI/QUAD
256MB, 1.8V, SPI NOR, WSON8
FLASH - NOR (SLC) Memory IC 256Mbit SPI - Quad I/O, QPI 133 MHz 6 ns 8-WSON (5x6)
| Win Source Electronics | ERSAELECTRONICS PTE. LTD. | DigiKey | Shenzhen Shengyu Electronics Technology Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 1353621-GD25LQ255EWIGR | 774-GD25LQ255EWIGR | 1970-GD25LQ255EWIGRTR-ND | GD25LQ255EWIGR | GD25LQ255EWIGR |
| Product Name | Integrated Circuits (ICs) - Memory - Memory | 256MB 1.8V Memory IC and Storage Component | Memory | Integrated Circuits (ICs) - Memory - Memory | Memory |
| Memory Category | Flash; Non-Volatile | Flash; Non-Volatile | Flash | Flash; Non-Volatile | Flash; FLASH |
| Access Time | 6 ns | 6 ns | 6 ns | ||
| Cycle Time | 60000 ns | 60000 to 2.40E6 ns | ? to 2.40E6 ns | ||
| Operating Temperature | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) |
