Manufacturer: GigaDevice Semiconductor
Win Source Part Number: 872686-GD25LD40CEIGR
Operating Temperature Range: -40°C ~ 85°C (TA)
Features: FLASH - NOR Memory IC 4Mb (512K x 8) SPI - Dual I/O 50 MHz 8-USON (2x3)
Package: 8-XFDFN Exposed Pad
Package: Reel - TR
Mounting: Surface Mount
Family Name: GD25LD40
Categories: Integrated Circuits (ICs)
Case / Package: 8-USON (2x3)
ECCN: EAR99
Popularity: Medium
Fake Threat In the Open Market: 42 pct.
Supply and Demand Status: Limited
Quantity per package: 3000
MSL Level: 3 (168 Hours)
Estimated Pruduction Lead Time: 19 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.32.0071
FLASH - NOR Memory IC 4Mb (512K x 8) SPI - Dual I/O 50MHz 8-USON (2x3)
IC FLSH 4MBIT SPI/DUAL I/O 8USON
FLASH - NOR Memory IC 4Mbit SPI - Dual I/O 50 MHz 8-USON (2x3)
IC FLSH 4MBIT SPI/DUAL I/O 8USON
| Win Source Electronics | DigiKey | Lingto Electronic Limited | Quarktwin Technology Ltd. | Shenzhen Shengyu Electronics Technology Limited | |
|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 872686-GD25LD40CEIGR | GD25LD40CEIGR-ND | GD25LD40CEIGR | GD25LD40CEIGR | GD25LD40CEIGR |
| Product Name | Memory - Unclassified Memory - GD25LD40CEIGR | Memory | Memory | Memory | Integrated Circuits (ICs) - Memory - Memory |
| Operating Temperature | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | ||
| Package Type | 8-USON (2x3) | 8-XFDFN Exposed Pad | 8-XFDFN Exposed Pad | ||
| Memory Category | Flash | Flash; Flash | Flash; FLASH | Flash; Non-Volatile | |
| Density | 4000 kbits | 4000 kbits | 4000 kbits | 4000 kbits |
