Frontier Electronics Corp. Chip Balun

Description
Frontier's series of chip baluns are manufactured using the LTCC (Low Temperature Co-fired Ceramic) process which allows for high performance in a small package. EIA 0603 ~ 0805 case sizes 50ω/50ω 50ω/100ω 50ω/200ω Frequency range: 869MHz ~ 5800MHz LTCC (Low Temperature Co-fired Ceramic)
Description
Frontier's series of chip baluns are manufactured using the LTCC (Low Temperature Co-fired Ceramic) process which allows for high performance in a small package. EIA 0603 ~ 0805 case sizes 50ω/50ω 50ω/100ω 50ω/200ω Frequency range: 869MHz ~ 5800MHz LTCC (Low Temperature Co-fired Ceramic)

Suppliers

Company
Product
Description
Supplier Links
Chip Balun -  - Frontier Electronics Corp.
Simi Valley, CA, USA
Chip Balun
Chip Balun
Frontier's series of chip baluns are manufactured using the LTCC (Low Temperature Co-fired Ceramic) process which allows for high performance in a small package. EIA 0603 ~ 0805 case sizes 50ω/50ω 50ω/100ω 50ω/200ω Frequency range: 869MHz ~ 5800MHz LTCC (Low Temperature Co-fired Ceramic)

Frontier's series of chip baluns are manufactured using the LTCC (Low Temperature Co-fired Ceramic) process which allows for high performance in a small package.

  • EIA 0603 ~ 0805 case sizes
  • 50Ω/50Ω 50Ω/100Ω 50Ω/200Ω
  • Frequency range: 869MHz ~ 5800MHz
  • LTCC (Low Temperature Co-fired Ceramic)
Supplier's Site

Technical Specifications

  Frontier Electronics Corp.
Product Category Transformers
Product Name Chip Balun
Category Signal
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