Fischer Electronik Thermal Compound, Syringe, 3Ml; Dispensing Method Fischer Elektronik WLPK 3

Description
THERMAL COMPOUND, SYRINGE, 3ML; Dispensing Method:Syringe; Volume:3ml; Weight:-; Product Range:-; SVHC:No SVHC (15-Jan-2019); Adhesive Colour:Silver RoHS Compliant: Yes
  • Thermal Compound, Syringe, 3Ml; Dispensing Method Fischer Elektronik - 68Y6515 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMAL COMPOUND, SYRINGE, 3ML; Dispensing Method:Syringe; Volume:3ml; Weight:-; Product Range:-; SVHC:No SVHC (15-Jan-2019); Adhesive Colour:Silver RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Compound, Syringe, 3Ml; Dispensing Method Fischer Elektronik - 68Y6515 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Compound, Syringe, 3Ml; Dispensing Method Fischer Elektronik
68Y6515
Thermal Compound, Syringe, 3Ml; Dispensing Method Fischer Elektronik 68Y6515
THERMAL COMPOUND, SYRINGE, 3ML; Dispensing Method:Syringe; Volume:3ml; Weight:-; Product Range:-; SVHC:No SVHC (15-Jan-2019); Adhesive Colour:Silver RoHS Compliant: Yes

THERMAL COMPOUND, SYRINGE, 3ML; Dispensing Method:Syringe; Volume:3ml; Weight:-; Product Range:-; SVHC:No SVHC (15-Jan-2019); Adhesive Colour:Silver RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 68Y6515
Product Name Thermal Compound, Syringe, 3Ml; Dispensing Method Fischer Elektronik
Unlock Full Specs
to access all available technical data

Similar Products

Ripley™ - E 468-2-7-55F - ELANTAS North America LLC
ELANTAS North America LLC
Ripley™
E 468-2-7-55F
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Silver Filled, Electrically Conductive Epoxy - EP21TDCS - Master Bond, Inc.
Master Bond, Inc.
Silver Filled, Electrically Conductive Epoxy
EP21TDCS
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Die Bonding Adhesives; Optional Premixed and Frozen; Grease, Paste; Gap Filler, Foam in Place Gasket
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D
745D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details